Side launch contactless signal conduit structures

ABSTRACT

Conduit structures for redirecting extremely high frequency (EHF) signals are disclosed herein. The conduit structures discussed herein are designed to re-direct EHF or RF signal energy from a first signal path to a second signal path. The conduit structures according to embodiments discussed herein can re-direct the RF signal energy while simultaneously adhering to specified signaling characteristic of the RF signal and minimizing stray RF signal radiation within a device to support device-to-device contactless communications.

FIELD OF THE INVENTION

The present disclosure relates to contactless connector assemblies andmore specifically to contactless signal conduits that define signalingpathways for extremely high frequency signals.

BACKGROUND

Advances in semiconductor manufacturing and circuit design technologieshave enabled the development and production of integrated circuits (ICs)with increasingly higher operational frequencies in the non-wired realm.As a result, electronic products and systems incorporating suchintegrated circuits are able to provide much greater functionality thanprevious generations of products. This additional functionality hasgenerally included the processing of increasingly larger amounts of dataat increasingly higher speeds. The higher operation speeds can result inenhanced radio frequency signal propagation that has a tendency todisperse in undesired ways that can cause signal loss and crosstalk.

BRIEF SUMMARY

Conduit structures for redirecting extremely high frequency (EHF)signals are disclosed herein. The conduit structures discussed hereinare designed to re-direct EHF or RF signal energy from a first signalpath to a second signal path. The conduit structures according toembodiments discussed herein can re-direct the RF signal energy whilesimultaneously adhering to specified signaling characteristic of the RFsignal and minimizing stray RF signal radiation within a device tosupport device-to-device contactless communications.

An air-filled dielectric conduit structure for use with a contactlesscommunications unit (CCU) mounted to a substrate, wherein the CCU isoperative to selectively transmit and receive RF signals along a firstpath, is provide. The conduit structure can include a dielectricstructure comprising an RF interface region, an external tapered region,an internal tapered region, and an air-filled cavity, wherein the CCU iscapped by the air-filled cavity, and wherein a combination of theair-filled cavity and internal and external tapered regions redirects RFsignals transmitted by the CCU along the first path to the RF interfaceregion via a second path and redirects RF signals received via the RFinterface region along the second path to the CCU via the first path.

A dielectric insert dielectric conduit structure for use with acontactless communications unit (CCU) mounted to a substrate, whereinthe CCU is operative to selectively transmit and receive RF signalsalong a first path, is provided. The conduit structure can include ametallized cover constructed to be mounted to the substrate and to coverthe CCU, the metallized cover comprising an opening through which the RFsignals travel along a second path; and a dielectric insert constructedto be secured within the metallized cover and to be positioned adjacentto the CCU, the dielectric insert comprising an RF interface positionedadjacent to the opening, wherein a combination of the metallized coverand the dielectric insert redirects RF signals transmitted by the CCUalong the first path to the RF interface region via the second path andredirect RF signal received via the RF interface region along the secondpath to the CCU via the first path.

A system is provided that includes a substrate, a plurality ofcontactless communications units (CCUs) mounted to the substrate,wherein the CCUs are operative to selectively transmit and receive RFsignals along respective first paths, and a plurality of RF signalredirection structures, each structure mounted over one of the pluralityof CCUs and secured to the substrate, wherein each RF signal redirectionstructure is operative to redirect RF signals from the first path to asecond path or redirect RF signals from the second path to the firstpath for each CCU.

BRIEF DESCRIPTION OF THE DRAWINGS

Having thus described communication between devices in general terms,reference is now made to the accompanying drawings, which are notnecessarily drawn to scale, and wherein:

FIG. 1 illustrates an embodiment of a communication system;

FIG. 2A shows a grossly simplified and illustrative communication unitmounted to substrate, according to an embodiment;

FIG. 2B shows another grossly simplified and illustrative communicationunit mounted to substrate, according to an embodiment;

FIGS. 3A-3I show several different views of an air-filled dielectricconduit structure, according to an embodiment;

FIGS. 4A-4C show illustrative perspective, top, and side views,respectively of multiple air-filled dielectric conduit structures,according to various embodiments;

FIGS. 5A and 5B show illustrative RF signal propagation of FIGS. 4A and4C, respectively, according to various embodiments;

FIG. 6 shows an illustrative cross-sectional view of dielectric insertconduit structure, according to an embodiment;

FIGS. 7A-7K show several different views of dielectric insert conduitstructure, according to an embodiment;

FIG. 8 shows an illustrative side view of a signal redirecting conduitstructure, according to an embodiment; and

FIG. 9 shows an illustrative top view of a docking system using signalredirecting conduit structures according to an embodiment.

DETAILED DESCRIPTION

Illustrative embodiments are now described more fully hereinafter withreference to the accompanying drawings, in which representative examplesare shown. The disclosed communication system and method may be embodiedin many different forms and should not be construed as limited to theembodiments set forth herein. Like numbers refer to like elementsthroughout.

In the following detailed description, for purposes of explanation,numerous specific details are set forth to provide a thoroughunderstanding of the various embodiments. Those of ordinary skill in theart will realize that these various embodiments are illustrative onlyand are not intended to be limiting in any way. Other embodiments willreadily suggest themselves to such skilled persons having the benefit ofthis disclosure.

In addition, for clarity purposes, not all of the routine features ofthe embodiments described herein are shown or described. One of ordinaryskill in the art would readily appreciate that in the development of anysuch actual embodiment, numerous embodiment-specific decisions may berequired to achieve specific design objectives. These design objectiveswill vary from one embodiment to another and from one developer toanother. Moreover, it will be appreciated that such a development effortmight be complex and time-consuming but would nevertheless be a routineengineering undertaking for those of ordinary skill in the art havingthe benefit of this disclosure.

In today's society and ubiquitous computing environment, high-bandwidthmodular and portable electronic devices are being used increasingly.Security and stability of communication between and within these devicesis important to their operation. In order to provide improved securehigh-bandwidth communications, the unique capabilities of contactlesscommunication between electronic devices and between sub-circuits withineach device may be utilized in innovative and useful arrangements.

Such communication may occur between radio frequency communicationunits, and communication at very close distances may be achieved usingEHF frequencies (typically, 30-300 GHz) in an EHF communication unit. Anexample of an EHF communications unit is an EHF comm-link chip.Throughout this disclosure, the terms comm-link chip, and comm-link chippackage are used to refer to EHF antennas embedded in IC chips orpackages.

The acronym “EHF” stands for Extremely High Frequency, and refers to aportion of the electromagnetic (EM) spectrum in the range of 30 GHz to300 GHz (gigahertz). The term “transceiver” may refer to a device suchas an IC (integrated circuit) including a transmitter (Tx) and areceiver (Rx) so that the integrated circuit may be used to bothtransmit and receive information, such as data. Generally, a transceivermay be operable in a half-duplex mode (alternating between transmittingand receiving), a full-duplex mode (transmitting and receivingsimultaneously), or configured as either a transmitter or a receiver. Atransceiver may include separate integrated circuits for transmit andreceive functions. The terms “contactless,” “coupled pair,” and “closeproximity coupling” as used herein, refer to electromagnetic (EM) ratherthan electrical (wired, contact-based) connections and transport ofsignals between entities (such as devices). As used herein, the term“contactless” may refer to a carrier-assisted, dielectric couplingsystem. The connection may be validated by proximity of one device to asecond device. Multiple contactless transmitters and receivers mayoccupy a small space. A contactless link established withelectromagnetics (EM) may be channelized in contrast with a wirelesslink which typically broadcasts to several points.

FIG. 1 illustrates a communication system 100. As shown, system 100 mayinclude a first device 110 configured to communicate with a seconddevice 120. First device 110 may be configured to communicate withand/or connect to second device 120 and vice versa. Further, firstdevice 110 and second device 120 can be any apparatus capable ofconnecting and communicating with each other. First device 110 maycouple directly to device 120 via a direct coupling or via a physicalcoupling member (e.g., cable) that can couple the two devices together.For example, device 110 can be a device such as a mobile device or acomputer, and device 120 can be a cable device such as a dongle designedto interface with the device 110. First device 110 may include housing111 that encompasses substrate 112, one or more EHF contactlesscommunication units (CCUs) 113, conduit structure 114, and interface116. Similarly, second device 120 may include housing 121 thatencompasses substrate 122, one or more EHF contactless communicationunits (CCUs) 123, conduit structure 124, and interface 126.

Housings 111 and 121 may represent the structure that forms the outerdimensions of devices 110 and 120. Housings 111 and 121 may beconstructed from any suitable material or materials. In someembodiments, interface 116 may be integrated within housing 111. Forexample, interface 116 may be a separate component that is coupled tohousing 111. As another example, a portion of housing 111 can bedesignated as the interface. That is, the housing itself serves as theinterface without the need for a separate component. Interface 116 mayprovide indicia and/or device coupling mechanisms (e.g., keyingstructure, magnets, etc.) for specifying the location of the interfaceand for connecting to the interface of another device.

Substrates 112 and 122 may be any suitable structure on which CCUs 113and 123 can reside. For example, substrates may be a circuit board, aprinted circuit board, or a flexible printed circuit board. CCUs 113 and123 may be positioned on their respective substrates 112 and 122 in amanner that minimizes a distance between the substrate and respectiveinterfaces 116 and 126. Such placement may assist in managing signalpropagation from the CCUs to the interface.

EHF CCUs 113 and 123 can be EHF transceivers capable of selectivelytransmitting and receiving EHF signals. When operating as a transmitter,the EHF CCUs may transmit an electromagnetic EHF signal, and whenoperating as a receiver, the EHF CCUs may receive an electromagnetic EHFsignal. For example, in one embodiment, device 110 can include two EHFCCUs and device 120 can include two EHF CCUs. In device 110, a first EHFCCU may operate as a transmitter and a second EHF CCU may operate as areceiver. Similarly, device 120 may include first and second EHF CCUsthat operate as transmitter and receiver, respectively. The transmitterEHF CCU of device 110 may transmit EHF signals to the receiver EHF CCUof device 120, and the transmitter EHF CCU of device 120 may transmitEHF signals to the receiver EHF CCU of device 110.

Conduit structures 114 and 124 may manage the propagation of EHF signalsthrough one or more channels that exist between EHF CCUs and theinterface by containing the EHF signal energy within the confines ofeach channel. All channels referred to herein may be EHF containmentchannels that guide and contain EHF signal energy. The dimensions of aradiation field associated with a first EHF CCU can potentially overlapthe radiation field of one or more other EHF CCUs. Such overlap cancause cross-talk or interference with EHF signaling. Conduit structure114 may provide one or more EHF containment channels or pathways thatexist between EHF CCUs 13 and interface 116 to prevent the radiationfields of multiple EHF CCUs from overlapping each other. Similarly,conduit structure 124 may provide one or more EHF containment channelsor pathways that exist between EHF CCUs 123 and interface 126. An EHFcontainment channel may exist for each EHF communication unit, and eachchannel is effectively isolated from each other to prevent cross-talkand signal degradation. Thus, the conduit structure can simultaneouslydirect EHF signals along desired pathways and prevent the EHF signalsfrom traversing or entering undesired regions. Each channel ofstructures 114 and 124 can direct or focus EHF signal energy into across sectional area smaller than the transverse dimensions of the EHFCCU's radiation field. As a result, the EHF signals can be focused totravel along a desired signal path and away from undesirable paths.

The conduit structure can be secured within each device in a variety ofways. In one approach, conduit structure 114 may interface withsubstrate 112 and interface 116. In this approach, structure 114 maysurround EHF CCU 113. If multiple CCUs 113 exist, structure 114 mayinclude multiple channels that each independently surround a respectiveone of the CCUs. In another approach, conduit structure 114 can bemounted to interface 116 and be suspended over EHF CCU 113. In yetanother approach, conduit structure 114 can be mounted to substrate 112and extend in the direction of interface 116.

The conduit structures can be constructed from a combination ofdifferent materials to shape the direction of signal propagation and tomitigate EHF leakage (which may cause cross-talk). These materials caninclude EHF transmissive materials that are operable to facilitatepropagation of EHF signals, EHF reflective materials that are operableto reflect EHF signals, and EHF absorptive materials that are operableto absorb EHF signals. Examples of transmissive materials can includeplastics and other materials that are electrically non-conductive (i.e.,dielectric). Reflective materials can include, for example, metals,metal alloys, metal foam, and other materials that are electricallyconductive. Examples of absorptive materials can include, for example,magnetically loaded, rubber materials that are electricallynon-conductive, but exhibit effective EHF dampening resonance due totheir high permittivity and permeability.

In some embodiments, the conduit structures can be constructed from justone of the different material types. For example, the conduit structurecan be constructed from just the EHF transmissive material or just theEHF reflective material. In other embodiments, the structure can beconstructed from two or more of the different material types. Forexample, one portion can be constructed from transmissive materials, andanother portion can be constructed from reflective materials.

Conduit structures 114 and 124 may be constructed to exhibit anysuitable shape, and can be constructed from a single component ormultiple components. Regardless of shape and construction configuration,each conduit may include at least one signal collimating structure thathas a channel existing within the collimating structure. Any suitableshape, including for example, rectangular, elliptical, or polygonalshapes of any suitable dimension may characterize each channel. Thecollimating structure may be constructed from, lined with, or coatedwith an EHF reflective material that may simultaneously guide EHFsignals along the channel and prevent those same signals frompenetrating the channel wall.

In addition to providing one or more pathways for channeling EHFsignals, the conduit structures may protect the EHF CCUs from shockevents. That is, during an event that imparts shock energy to thedevice, such as a device drop, the conduit structure can absorb theshock to prevent potentially damaging energy transfer to the EHF CCUs.In one embodiment, the shock protection can be achieved by constructingat least a portion of the conduit structure from a relatively rigidmaterial (e.g., plastic) that covers the EHF CCU(s). In anotherembodiment, shock protection can be achieved using a relativelycompliant material (e.g., foam) that also covers the EHF CCU(s). In yetanother embodiment, a combination of relatively rigid and compliantmaterials may be used to provide protection.

The conduit structure may also be constructed to account for tolerancevariations in device stackup. That is, variations in componentconstruction can vary the stackup tolerances when assembled. Forexample, the distance between the EHF units and the interface may varydepending on construction and variations in components. In one build,the distance may be x and in another build, the distance may be y, wherey is greater than x. The conduit structure may include a compliantmaterial that is designed to accommodate variations in stackup. Thecompliant material may be compressible and thus able to ensure that theconduit structure makes a secure and flush connection with theinterface.

Devices 110 and 121 may include each include anti-spurious radiation(ASR) regions that may minimize transmission of spurious EHF signalsthat can exist at or near a break in a channel containing the EHFsignals. A break may occur at locations where the conduit structureinterfaces with another structure or component. For example, a potentialbreak may exist at the junction formed between interface 116 andstructure 114. Another potential break may exist at the junction formedbetween substrate 112 and structure 114. Yet another potential break mayexist on the surface of interface 116 that is mounted to housing 111 orthe portion of housing 111 designated as the interface. ASR regions canbe incorporated into the conduit structures or mounted thereto to combatspurious EHF signals. The ASR regions can include various anti-spuriousradiation materials and/or grooves. ASR materials can include anycombination of EHF transparent, EHF reflective, and EHF absorptivematerials. Grooves can include grooves or channels that exist instrategic locations within or adjacent to the conduit structures.

FIG. 2A shows a grossly simplified and illustrative EHF CCU 200 mountedto substrate 210, according to an embodiment. CCU 200 may includetransducer 202 that is designed to transmit contactless EHF signals inthe direction of signal path 220. Path 220 projects in a directionperpendicular to surface 211 of substrate 210. In other words, path 220projects in the Y-axis direction towards CCU 230. The direction ofsignal path 220 is merely illustrative. For example, the signal path canbe directed in any suitable direction. For example, FIG. 2B shows agrossly simplified and illustrative EHF CCU 250 mounted to substrate260. CCU 250 may include transducer 252 that is designed to transmitcontactless EHF signals in the direction of signal path 270. Path 270projects in a direction co-planar to surface 261 of substrate 260. Inother words, path 270 projects in the X-axis direction.

Thus, although it may be desirable for EHF signals to be transmittedalong a desired signal path (e.g., such a path 220), non-directed, freeflowing EHF signal energy may emit in all directions, thereby resultingin radiation patterns that are not confined to the desired signal path.Non-directed transmission of EHF signals in undesired directions maycause cross-talk and multi-path cross-talk. Cross-talk may occur amongadjacent CCUs in the same device. Such cross-talk may exist over-the-airand/or within circuit boards. This is illustrated in FIG. 2A, whichshows cross-talk EHF signal path 242 emanating from CCU 200 to CCU 240.Multi-path cross-talk may occur when a CCU a first device communicateswith an unintended CCU of a second device. This is illustrated FIG. 2A,which shows multi-path cross-talk signal path 252 emanating from CCU 200to CCU 250. The non-directed transmission of EHF signals may also resultin reduced signal strength, thereby potentially making it more difficultfor receiving CCUs to capture the EHF signals. Various embodimentsdiscussed herein are used to direct EHF signals along desired signalpathways (e.g., pathway 220) and eliminate undesired pathways (e.g.,pathways 242 and 252). Spurious radiation may also contribute tocross-talk and/or signal loss and can occur when a break exists in achannel containing the EHF signals. The breaks may occur at locationswhere two devices are mated together, for example. Embodiments describedbelow in connection with FIGS. 3-9 provide different solutions tomitigate cross talk and multi-path cross talk, among other things.

The conduit structures discussed herein are designed to re-direct the RFsignal energy from a first signal path to a second signal path. Forexample, a CCU residing on a substrate such as a circuit board may bedesigned to transmit and receive RF signal energy along a path that isperpendicular to a top surface of the substrate. In other words,assuming no path altering structures are present, the RF signal maytravel along a path that is vertical. However, the vertical path may notbe the desired path for the RF signal. Depending on the application, thedesired path may range anywhere between 1 and 179 degrees, 10 and 170degrees, or 85 and 95 degrees with respect to the vertical path. Forexample, in one embodiment the desired path may be 90 degrees withrespect to the vertical path, may exist at an acute angle with respectto the vertical path, or may exist at an obtuse angle with respect tothe vertical path. In other words, the desired signal path can be ahorizontal path despite the fact the CCU is designed for vertical pathRF communications. The conduit structures according to embodimentsdiscussed herein can re-direct the RF signal energy while simultaneouslyadhering to specified signaling characteristic of the RF signal andminimizing stray RF signal radiation within a device to supportdevice-to-device contactless communications.

FIGS. 3A-3I show several different views of an air or dielectric-filledconduit structure (CS) 300 according to an embodiment. The dielectricmaterials may be plastics, including ABS or LDPE. FIGS. 3A-3C showperspective views of CS 300, with FIGS. 3B-3B showing hidden lines. FIG.3D shows an illustrative exploded view of CS 300, CCU 390, and substrate398. FIG. 3E shows an illustrative cross-sectional view taken along lineE-E of FIG. 3A. FIG. 3F shows an illustrative cross-sectional view takenalong line F-F of FIG. 3A. FIG. 3G shows an illustrative side view withhidden lines, and FIG. 3H shows an illustrative top view with hiddenlines. FIG. 3I shows illustrative perspective view of CS 300 with metalcoating 370 applied to selective portions of the outer surface of CS300. FIGS. 3A-3I will be collectively referred to herein.

CS 300 is designed to be placed over CCU 390 and substrate 398 such thatCCU 390 exists in an air pocket existing within CS 300. CCU 390 may bedesigned to transmit and receive RF signals along first path 301, whichruns perpendicular with respect to CCU 390 and a top surface ofsubstrate 398. The desired RF signal path is shown as second signal path302, which runs perpendicular to path 301 and enters/exits RF interfaceregion 330. CS 300 may be designed to fit like a cap over CCU 390, andin some embodiments, may interlock with substrate 398 for secure fit.The air pocket may be defined by internal dimensions of cavity 320within CS 300. CS 300 may be a molded plastic part constructed to have aparticular dielectric constant. The mold is defined by externaldimensions that define outer dimensions of CS 300 and is also defined byinternal dimensions of cavity 320. Both external and internal dimensionsof CS 300 may be selected to re-direct RF signal energy transmittedalong path 301 by CCU 390 to path 302 so that it passes out of RFinterface region 330 and to re-direct RF signals received via RFinterface region 330 along path 302 to path 301 so that it can bereceived by CCU 390. RF interface region 330 may represent theentry/exit region of RF signals passing into or out of CS 300. RFinterface region 330 has a cross-sectional area and may serve as theportion of CS 300 that interfaces with a housing of a device. See, FIGS.4A-C, which show RF interfacing regions positioned within a housing.

The particular shape of both external and internal dimensions can beselected based on a variety of factors, including but not limited to,the re-direction angle, dielectric constant of the plastic mold, thesize of RF interface region 330, desired RF signal propagation, andmetallization of the plastic. The dielectric constant of the plasticmold may be uniform throughout, or the dielectric constant can vary. Forexample, in one embodiment, the dielectric constant may be the same inregions 330, 332, and 334. As another example, in another embodiment,the dielectric constant of region 330 may be different than thedielectric constant of regions 332 and 334. The air or dielectricmaterial contained within cavity 320 has a dielectric constant. Thedielectric constant of regions 330, 332, and 334 may be selected basedon the assumption that the CCU 390 is directly interfacing with the aircontained in cavity 332. If, for example, cavity 332 is filled withmatter other than air (e.g., such as an insert shown in FIG. 6), thedielectric of regions 330, 332, 334 may be selected based on thedielectric of the matter contained in cavity 320, and/or thecross-sectional area of region 330 may be selected based on thedielectric of the matter contained in cavity 320. Selection of thedielectric can be made based on several different factors: 1) RFrequirements of the design—the cavity is designed for a specificdielectric constant material to give the greatest signal strength andreduce multi-modes and 2) within the range of dielectric allowed by thedesign, the material may be chosen based on cost of material, ease ofmaterial processing, and/or material processing availability.

The minimum dimension of cavity 320 is such that it is slightly largerthan the footprint of CCU 390. This way, CS 300 can fit over CCU 390.The wall thickness of CS 300 may be at least 0.75 millimeters.

RF signal propagation refers to the speed of the RF signal travelingthrough CS 300. The internal and outer dimensions of CS 300 can affectRF signal propagation. In addition, transitions in dielectric constants(e.g., from cavity 320 to region 330) can also affect signalpropagation. Further still, the metallization of the plastic may affectRF signal propagation. In some embodiments, CS 300 may include a metallayer that prevents RF signal penetration through selective regions ofCS 300. See, for example, FIG. 3I, which shows cross-hatch linesindicating presence of metallization. For example, the metal layer mayexist on selected or all surfaces of CS 300. The metal layer may bedeposited in any number of different ways, including, for example,electroplating, submersion in an electrolytic bath, or sputtering ofmetal on the plastic in a vacuum or a via plasma deposition. In otherembodiments, metal plates may be placed on the outside surfaces. Theskin depth of the metal layer is sufficient to prevent electromagneticpenetration. The skin depth may depend on the porosity/smoothness of theplastic and the metal material choice. Some examples of suitable metalscan be aluminum, copper, or a copper-nickel. The metal thickness may,for example, range from 1 micron to 10 microns. In copper-nickelembodiments, the nickel may be coated with an anti-oxidation layer toprevent the metal from oxidizing and the skin depth of the nickel may begreater than the skin depth of the copper. There may be no metallizationof the inner dimensions. In some embodiments, the metallization onlyexists on the external dimensions.

The outer dimensions of CS 300 can include several tapered surfaces suchas tapered surfaces 311-314 and the inner dimensions of CS 300 may alsoinclude several tapered surfaces such as tapered surfaces 321-324. Thecombination of the tapered surfaces, in combination with themetallization of the outer surfaces are designed to re-direct RF signalenergy from the first path 301 to second path 302, or vice versa. Thetapered portions assist in the re-direction of the RF signal bycontrolling the transition from the air or dielectric material containedin cavity 320 to RF interface portion 330. In an embodiment where cavity320 is filled with air, the effect is that the tapered portions form anair-plastic transition region within CS 300, where the plastic region isrepresented by RF interface portion 330. In some embodiments, thetapered surfaces of the outer dimension may have corresponding taperedsurfaces of the inner dimensions. For example, surface 311 maycorrespond to surface 321, surface 312 may correspond to surface 322,surface 313 may correspond to surface 323, etc. In some embodiments, thetaper angle of the inner dimension tapered surfaces may be greater thanthe taper angle of the outer dimension tapered surfaces. For example,the angle between a vertical line parallel to path 301 and taperedsurface 321 is α₁ and the angle between a vertical line parallel to path301 and tapered surface 331 is β₁, where α₁ is greater than β₁. Asanother example, the angle between a horizontal line parallel to path302 and tapered surface 324 is α₂ and the angle between a horizontalline parallel to path 302 and tapered surface 334 is β₂, where α₂ isgreater than β₂.

The size of the cross-sectional area of RF interfacing region 320 may beselected to strike a balance between misalignment tolerance with adevice housing and RF mode control of the RF signal. Misalignmenttolerance can refer to physical alignment of RF interfacing region 320within an interfacing structure such as a housing (e.g., see FIG. 4A). Arelatively larger cross-sectional area may result in better alignment,whereas a relatively smaller cross-sectional area may be moresusceptible to misalignment. Mode control can be characterized assingle-mode or multi-mode. Single-mode is less susceptible to distortionand resonance, and can be more energy efficient than multi-mode. Themisalignment tolerance and the mode control work against each otherdepending on the size of the cross-sectional area of RF interfacingregion 320. A larger cross-sectional area can increase the misalignmenttolerance, but can push the mode control into multi-mode, whereas asmaller cross-sectional area decreases the misalignment tolerance, butbetter enables single-mode control. The dielectric constant of RFinterfacing region 320 may affect its sizing to achieve the balance ofalignment and mode control. The dielectric constant may affect thewavelength of the RF signal. A higher dielectric constant results in ashorter wavelength, thereby enabling use of a smaller cross-sectionalarea. A lower dielectric constant results in a larger wavelength, whichmay require use of a larger cross-sectional area.

FIGS. 4A-4C show illustrative perspective, top, and side views,respectively of multiple CSs according to an embodiment. FIG. 4A showsdevice 400 that includes housing 402, and device 450 that includeshousing 452. Device 400 can include CS 410 and 420, and device 450 caninclude CS 420 and 470. CS 410, 420, 460, and 470 can be similar to CS300 of FIGS. 3A-3I. CS 410 interfaces with housing 402 via its RF signalinterfacing region 412, and CS 420 interfaces with housing 402 via itsRF signal interfacing region 422. CS 460 interfaces with housing 452 viaits RF signal interfacing region 462, and CS 470 interfaces with housing452 via its RF signal interfacing region 472. CS 410 is operative tocommunicate with CS 460 via RF signal interfacing regions 512 and 462(and any air gap that may exist between housings 402 and 452) and CS 420is operative to communicate with CS 470 via RF signal interfacingregions 422 and 472 (and any air gap that may exist between housings 402and 452). Housings 402 and 452 may be constructed from, or include,metal that prevents RF signals from passing through the metalizedportions of housings 402 and 452. As such, RF signal passage throughhousings 402 and 452 is limited to the RF interfacing regions of theCSs.

FIGS. 5A and 5B show illustrative RF signal propagation of FIGS. 4A and4C, respectively, according to various embodiments. In both FIGS. 5A and5B, assume that CS 410 is transmitting signals to CS 460, and that nosignals are currently being transmitted between CS 420 and CS 470. Asshown in both FIGS. 5A and 5B, the RF signal radiation is relativelyconcentrated in RF interfacing portions 412 and 462 and passes throughan air gap existing between housings 402 and 452. A minimal amount of RFradiation is shown radiating within the air gap, thus showing that CSarrangement is able to contain and direct the RF signal energy to enablecontactless communications.

FIG. 6 shows an illustrative cross-sectional view of dielectric insertconduit structure (DICS) 600 according to an embodiment. DICS 600 isoperative to redirect the RF signal from path 601 to path 602, or viceversa. DICS 600 can include metalized cover 610, dielectric insert 620,CCU 630, and substrate 640. Metalized cover 610 completely covers CCU630, but has an open face to permit transmission of an RF signal intoand out of DICS 600. In one embodiment, metalized cover 610 may be aplastic molded part that is metalized to prevent electromagnetic signalsfrom passing through. The metallization embodiments discussed above canapply to metalized cover 610. In another embodiment, metallized covermay be constructed solely from metal. Although not shown in detail inFIG. 6, metalized cover 610 can include tapered inner and outer surfacesto assist in RF signal redirection.

Dielectric insert 620 is designed to fit inside metalized cover 610 andserve as a waveguide for RF signals being re-directed from path 601 topath 602, or vice versa. Dielectric insert 620 may be designed to occupyas much space within metalized cover 610 as possible to eliminate airgaps. Dielectric insert 620 may be a plastic molded part having aconstant or varying dielectric constant. An advantage of DICS 600 over,for example, CS 300 is that use of dielectric insert 620 enables theoverall size of DICS 600 to be smaller than CS 300. The shape ofdielectric insert 620 is designed to balance modality, misalignmenttolerance, and RF signal efficiency. In some embodiments, insert 620 mayalso interface with a housing to permit RF signals to pass into or outof a device containing DICS 600.

FIGS. 7A-7K show several different views of dielectric insert conduitstructure (DICS) 700 according to an embodiment. DICS 700 embodies theprinciples of DICS 600, but show many more details associated with itsmetalized cover and dielectric insert. FIG. 7A shows an illustrativeperspective view of DICS 700. FIG. 7B shows an illustrative perspectiveview of DICS 700 with hidden lines. FIG. 7C shows an illustrative sideview of DICS 700 and FIG. 7 D shows the same side view with hiddenlines. FIG. 7E shows an illustrative cross-sectional view taken alongline E-E of FIG. 7A. FIGS. 7F-7H show illustrative perspective, top andside views of metallized cover 710. FIG. 71 shows an illustrativecross-sectional view of metallized cover 710 taken along line H-H ofFIG. 7F. FIGS. 7J and 7K different perspective views of dielectricinsert 720.

DICS 700 can include metallized cover 710, dielectric inserts 740, CCUs790, first substrate 792, and second substrate 794. First substrate 792may be a circuit board on which CCUs 790 are mounted. Second substrate794 may be another circuit board or structure that supports firstsubstrate 792. Metallized cover 710 can a plastic component that ismetallized or it can be a metal component. In one embodiment, theentirety of metallized cover 710 is completely covered with metal,including internal and exterior surfaces. Metallized cover 710 caninclude one or more dielectric receiving members 712, which areconstructed to receive dielectric inserts 740. As shown, two dielectricreceiving members 712 that are connected via bridge member 704. Bothmembers 712 may have openings facing the same direction at the sameattitude. The attitude may refer to the orientation of the opening withrespect to a planar surface of substrate 792. For example, the attitudeof the opening would be zero if it is oriented 90 degrees relative tothe planar surface of substrate 792. It should be appreciated that theopenings may face different directions at the same or differentattitude. For example, one opening may be oriented in a first direction(e.g., 0 degrees) and a second opening may be oriented in a seconddirection (e.g., 90 or 180 degrees). The attitudes of each opening maybe the same or different.

Dielectric receiving member 712 has outer dimensions and innerdimensions. The inner dimensions may define cavity 720. The outerdimensions may be shaped to assist in the re-direction of the RF signal.For example, member 712 may include sloped surface 713, and curvedsurfaces 714 and 715 to promote re-direction. Cavity 720 may also beshaped to assist in the re-direction of the RF signal. In addition,cavity 720 may be further shaped to interface with dielectric insert740. For example, cavity 720 may include curved surfaces 722, 723, and724, and tapered surfaces 725. The slope, curved, and tapered surfacesof the external and internal surfaces are all designed to promotere-direction of the RF signal while simultaneously preventingmulti-moding.

Both cavity 720 and insert 740 may be dimensioned such that insert 740occupies as much as cavity 720 as possible. For example, any curves ortapers in cavity 720 are emulated by similarly shaped curves and tapersin insert 740. As a specific example, insert 740 may have curvedsurfaces 742-744 that are designed to interface with curved surfaces722-724 of cavity 720, and may include tapered surfaces 745 that aredesigned to interface with tapered surfaces 725.

Dielectric insert 740 may include face portion 750, wall portions 754,and pocket 756. The size and shape of pocket 756 may be defined bytapered portion 745 and wall portions 754. If desired, pocket 756 couldbe made bigger by extending wall portion 754. Face portion 750 may beextend outside of cavity 720 and may serve as the entry/exit point forRF signals. When insert 740 is contained within cavity 720, minimumclearance distances 760-762 may exist between insert 740 and either CCU790 or substrate 792.

FIG. 8 shows an illustrative side view of signal redirecting conduitstructure (SRCS) 800 position above CCU 810 and substrate 820, accordingto an embodiment. CCU 810 is designed to transmit an RF signal alongpath 801, which runs horizontal with respect to CCU 810 and substrate820, on which CCU 810 is mounted. Such CCUs may be referred to asside-firing as they direct RF signal energy along a plane parallel tothe CCU as opposed to perpendicular to that plane. SRCS 800 isconstructed to redirect RF signal energy from path 801 to path 802, orvice versa. SRCS 800 may be an air-filled dielectric conduit structureor a dielectric insert conduit structure, and it should be appreciatedthat the teachings discussed above apply to SRCS 800.

FIG. 9 shows an illustrative top view of docking system 900 using signalredirecting conduit structures according to an embodiment. Dockingsystem 900 represents an ambidextrous connection mechanism that enablesa device to be connected thereto without regard for a specificorientation. That is, the device (not shown) can be connected to dockingsystem 900 in a first orientation or a second orientation andcontactlessly communicate data between the device and system 900. System900 can include docking structure 910 that houses signal redirectingconduit structures 920, 930, 940, and 950. Structures 920 and 930 aredesigned to transmit and/or receive signals via interface regions 922and 932, respectively, and structures 940 and 950 are designed totransmit and/or receive signals via interface regions 942 and 952.Interface regions 922 and 932 are facing the opposite direction ofinterface regions 942 and 952.

It is believed that the disclosure set forth herein encompasses multipledistinct inventions with independent utility. While each of theseinventions has been disclosed in its preferred form, the specificembodiments thereof as disclosed and illustrated herein are not to beconsidered in a limiting sense as numerous variations are possible. Eachexample defines an embodiment disclosed in the foregoing disclosure, butany one example does not necessarily encompass all features orcombinations that may be eventually claimed. Where the descriptionrecites “a” or “a first” element or the equivalent thereof, suchdescription includes one or more such elements, neither requiring norexcluding two or more such elements. Further, ordinal indicators, suchas first, second or third, for identified elements are used todistinguish between the elements, and do not indicate a required orlimited number of such elements, and do not indicate a particularposition or order of such elements unless otherwise specifically stated.

Whereas many alterations and modifications of the present invention willno doubt become apparent to a person of ordinary skill in the art afterhaving read the foregoing description, it is to be understood that theparticular embodiments shown and described by way of illustration are inno way intended to be considered limiting. Therefore, reference to thedetails of the preferred embodiments is not intended to limit theirscope.

What is claimed is:
 1. An air-filled dielectric conduit structure foruse with a contactless communications unit (CCU) mounted to a substrate,wherein the CCU is operative to selectively transmit and receive RFsignals along a first path, the conduit structure comprising: adielectric structure comprising an RF interface region, an externaltapered region, an internal tapered region, and an air-filled cavity,wherein the CCU is capped by the air-filled cavity, and wherein acombination of the air-filled cavity and internal and external taperedregions redirects RF signals transmitted by the CCU along the first pathto the RF interface region via a second path and redirects RF signalsreceived via the RF interface region along the second path to the CCUvia the first path.
 2. The conduit structure of claim 1, furthercomprising a metallized layer that selectively covers external surfacesof the dielectric structure, but not a face of the RF interface, andwherein the metallized layer prevents RF signal penetration through thecovered surfaces of the dielectric structure.
 3. The conduit structureof claim 1, wherein a combination of the air-filled cavity, RF interfaceregion, and internal and external tapered regions ensure single modecontrol of the RF signal.
 4. The conduit structure of claim 1, wherein acombination of the air-filled cavity, RF interface region, and internaland external tapered regions strikes a balance between misalignmenttolerance of the RF interface region and mode control of the RF signal.5. The conduit structure of claim 1, wherein the RF interface region andthe external tapered regions are part of a single integrated structurethat define external dimensions of the dielectric structure, and whereinthe internal tapered regions and the air cavity are part of the singleintegrated structure that define internal dimensions of the dielectricstructure.
 6. The conduit structure of claim 1, wherein the externaltapered regions comprises a first external tapered region and theinternal tapered regions comprises a first internal tapered region,wherein the first external and internal tapered regions both mimic asimilar shape.
 7. The conduit structure of claim 6, wherein the firstinternal tapered region is characterized as having a larger taper anglethan a taper angle of the first external tapered region.
 8. A dielectricinsert dielectric conduit structure for use with a contactlesscommunications unit (CCU) mounted to a substrate, wherein the CCU isoperative to selectively transmit and receive RF signals along a firstpath, the conduit structure comprising: a metallized cover constructedto be mounted to the substrate and to cover the CCU, the metallizedcover comprising an opening through which the RF signals travel along asecond path; and a dielectric insert constructed to be secured withinthe metallized cover and to be positioned adjacent to the CCU, thedielectric insert comprising an RF interface positioned adjacent to theopening, wherein a combination of the metallized cover and thedielectric insert redirects RF signals transmitted by the CCU along thefirst path to the RF interface region via the second path and redirectRF signal received via the RF interface region along the second path tothe CCU via the first path, wherein the metallized cover comprises aninterior volume, and wherein the dielectric insert occupies asubstantial portion of the interior volume.
 9. The conduit structure ofclaim 8, wherein the second path is directed at an angle ranging between10 and 170 degrees relative to the first path.
 10. The conduit structureof claim 8, wherein the second path is directed to an angle rangingbetween 85 and 95 degrees relative to the first path.
 11. The conduitstructure of claim 8, wherein the metallized cover is a plasticstructure that is substantially covered by a metal.
 12. The conduitstructure of claim 8, wherein the dielectric insert is a plasticstructure that functions as a waveguide.
 13. The conduit structure ofclaim 8, wherein the RF interface region extends beyond a periphery ofthe metallized cover.
 14. A system comprising: a substrate; a pluralityof contactless communications units (CCUs) mounted to the substrate,wherein the CCUs are operative to selectively transmit and receive RFsignals along respective first paths, wherein the RF signals comprise RFradiation; and a plurality of RF signal redirection structures, eachstructure mounted over one of the plurality of CCUs and secured to thesubstrate, wherein each RF signal redirection structure is operative toredirect RF signals from the first path to a second path or redirect RFsignals from the second path to the first path for each CCU.
 15. Thesystem of claim 14, wherein the plurality of RF signal redirectionstructures are air-filled redirection conduit structures.
 16. The systemof claim 14, wherein the plurality of RF signal redirection structuresare dielectric insertion conduit structures.
 17. The system of claim 14,further comprising a housing, wherein each of the plurality of RF signalredirection structures comprise RF interfacing regions that abut or areintegrated within the housing.
 18. The system of claim 14, wherein eachof the first paths is commonly aligned along a first direction, andwherein each of the second paths is commonly aligned along a seconddirection.
 19. The system of claim 14, wherein the plurality of CCUscomprises first, second, third, and fourth CCUs, wherein the first pathsassociated with the first and second CCUs are commonly aligned along afirst direction, and wherein the first paths associated with the thirdand fourth CCUs are commonly aligned along a second direction, whereinthe first and second directions are opposite of each other, and whereina second path associated with each of the redirecting structures isaligned with a third direction.